Developed as an all-round thermal paste with the best possible price-performance ratio, the thermal pastes of the EC360® CARBON series are the ideal thermal compound for gaming PCs and industrial cooling systems.

They offer ultimate stability and a high thermal conductivity of 5.15 W/mK.
A good consistency makes it easy to apply and spread.
At the same time, safe application is ensured as the thermal paste is not electrically conductive.
A low bleeding constant and good evaporation properties make it durable and ensure that it does not dry out.

Types and Configuration

Type	Available sizes
Tube	4 g, 20 g

Technical Properties

Properties	Unit	Value	Test method
Color	-	grey	visual
Thermal Conductivity	W/mk	5.15	ASTM D 5470
Thermal Resistance	°C-in2/W	0.04	ASTM D 5470
Specific Gravity	g / cm^3	2.5	ASTM D 792
Evaporation (150°/24h)	%	0.001	FED STD 791
Bleed (150°/24h)	%	0.05	FED STD 791
Viscosity	cP	12500	-
Dielectric Constant	1Mhz	5.1	ASTM D 150
Usable Temperatures	°C	-60 - 200	EN 244
Flame Rating	-	VO	UL 94