From small CPUs to industry solutions, EC360® Thermal Compounds offer a wide range of applications. With different thermal conductivities, sizes and strengths our thermal compounds can be tailored especially to your needs.
Thermal pads come in different types. There are thick gap-filler thermal pads that are used to bridge gaps (silicone-based thermal pads for example), as well as very thin thermal pads that are designed for direct contact (graphite sheets for example).
Silicone-based Thermal Pads
- EC360® GREEN: Flexible silicone-based allround thermal pads (Thermal conductivity: 2.5 W/mK)
- EC360® BLUE: Flexible silicone-based premium thermal pads (Thermal conductivity: 5 W/mK)
- EC360® BRONZE: High-Performance thermal pads for beginners (Thermal conductivity: 8 W/mK)
- EC360® SILVER: Mid-range High-Performance thermal pads (Thermal conductivity: 12 W/mK)
- EC360® GOLD: High-Performance thermal pads for intermediate users (Thermal conductivity: 14.5 W/mK)
- EC360® PLATINUM: Top-class High-Performance thermal pads (Thermal conductivity: 16.6 W/mK)
Graphite-based Thermal Pads
- EC360® GRAPHITE: Extreme-Performance graphite pads (Thermal conductivity: 25 / 1500 W/mK)
All thermal pads are manufactured in different sizes and thicknesses. The thermal pads can be cut into custom sizes on request.
- EC360® CARBON: Beginner Allround thermal paste (Thermal conductivity: 5.15 W/mK)
- EC360® EMERALD: Premium Allround thermal paste (Thermal conductivity:9 W/mK)
- EC360® DIAMOND: Advanced thermal paste (Thermal conductivity: 11 W/mK)
- EC360® RUBY: High-Performance thermal paste (Thermal conductivity: 13.4 W/mK)
Thermal Glue & Thermal Adhesive
- EC360® TAPE: Thermal adhesive with good adhesiveness (Thermal conductivity: 3 W/mK)
- EC360® TAPE STRONG: Extra strong thermal adhesive (Thermal conductivity: 1.2 W/mK)
- EC360® GLUE: Strong adhesive thermal glue (Thermal conductivity: 2 W/mK)
Our thermal adhesive is also available in many sizes and can be customized for you.