A mixture of organic silicone grease and filler give the EC360® GLUE series a high thermal conductivity combined with excellent adhesion qualities.
This combination makes it the perfect liquid glue for many applications. The primary use case is attaching heatsinks to RAM, Northbridge and other electrical components.
Its comparatively strong adhesion properties also make it a candidate for attaching heavier heatsinks permanently. When hardened the glue has a silicone like structure which allows a good durability also on flexible surfaces and makes it electrically insulating.
Types and Configuration
|Thermal Conductive Materials||40%|
|Thermal Conductivity||W/mk||2.0||ASTM D 5470|
|Thermal Resistance||°C-in2/W||0.246||ASTM D 5470|
|Surface Drying Time (25°)||minutes||6.0||-|
|Dielectric Constant||1Mhz||5.0||ASTM D 150|
|Usable Temperatures||°C||-60 - 250||EN344|