
Description
Designed as an all-round thermal paste with the best possible price-performance ratio the EC360® CARBON series is the ideal thermal interface material for gaming PCs and industrial cooling systems.
Nano-Carbon compounds blended in a base of nanometer sized metal oxide particles (silver/aluminum/ boron/zinc) enable ultimate stability and a high thermal conductivity of 5.15W/mK. Its good consistency makes it easy to spread and install.
It is long-lasting: low bleed, non-flowing and low evaporation mean it will stay in place and not dry out over time. At the same time, it is not electrically conductive, which allows a safe application.
Specs
Types and Configuration
Type | Available sizes |
---|---|
Tube | 3.5 g, 20 g |
Material Composition
Type | Percentage |
---|---|
Metal Oxide Compounds | 45% |
Carbon Compounds | 45% |
Silicone | 10% |
Technical Properties
Properties | Unit | Value | Test method |
---|---|---|---|
Color | - | grey | visual |
Thermal Conductivity | W/mk | 5.15 | ASTM D 5470 |
Thermal Resistance | °C-in2/W | 0.04 | ASTM D 5470 |
Specific Gravity | g / cm^3 | 2.5 | ASTM D 792 |
Evaporation (150°/24h) | % | 0.001 | FED STD 791 |
Bleed (150°/24h) | % | 0.05 | FED STD 791 |
Viscosity | cP | 12500 | - |
Dielectric Constant | 1Mhz | 5.1 | ASTM D 150 |
Usable Temperatures | °C | -60 - 200 | EN 244 |
Flame Rating | - | VO | UL 94 |