Designed as an all-round thermal paste with the best possible price-performance ratio the EC360® CARBON series is the ideal thermal interface material for gaming PCs and industrial cooling systems.

Nano-Carbon compounds blended in a base of nanometer sized metal oxide particles (silver/aluminum/ boron/zinc) enable ultimate stability and a high thermal conductivity of 5.15W/mK. Its good consistency makes it easy to spread and install.

It is long-lasting: low bleed, non-flowing and low evaporation mean it will stay in place and not dry out over time. At the same time, it is not electrically conductive, which allows a safe application.

Types and Configuration

Type	Available sizes
Tube	3.5 g, 20 g

Material Composition

Type	Percentage
Metal Oxide Compounds	45%
Carbon Compounds	45%
Silicone	10%

Technical Properties

Properties	Unit	Value	Test method
Color	-	grey	visual
Thermal Conductivity	W/mk	5.15	ASTM D 5470
Thermal Resistance	°C-in2/W	0.04	ASTM D 5470
Specific Gravity	g / cm^3	2.5	ASTM D 792
Evaporation (150°/24h)	%	0.001	FED STD 791
Bleed (150°/24h)	%	0.05	FED STD 791
Viscosity	cP	12500	-
Dielectric Constant	1Mhz	5.1	ASTM D 150
Usable Temperatures	°C	-60 - 200	EN 244
Flame Rating	-	VO	UL 94

Datasheets