Designed as an all-round thermal paste with the best possible price-performance ratio the EC360® CARBON series is the ideal thermal interface material for gaming PCs and industrial cooling systems.
Nano-Carbon compounds blended in a base of nanometer sized metal oxide particles (silver/aluminum/ boron/zinc) enable ultimate stability and a high thermal conductivity of 5.15W/mK. Its good consistency makes it easy to spread and install.
It is long-lasting: low bleed, non-flowing and low evaporation mean it will stay in place and not dry out over time. At the same time, it is not electrically conductive, which allows a safe application.
Types and Configuration
|Tube||3.5 g, 20 g|
|Metal Oxide Compounds||45%|
|Thermal Conductivity||W/mk||5.15||ASTM D 5470|
|Thermal Resistance||°C-in2/W||0.04||ASTM D 5470|
|Specific Gravity||g / cm^3||2.5||ASTM D 792|
|Evaporation (150°/24h)||%||0.001||FED STD 791|
|Bleed (150°/24h)||%||0.05||FED STD 791|
|Dielectric Constant||1Mhz||5.1||ASTM D 150|
|Usable Temperatures||°C||-60 - 200||EN 244|
|Flame Rating||-||VO||UL 94|