EC360® PCM Phase Change Material

The EC360® PCM series offers phase change material with an excellent thermal conductivity of 6.0 W/mK. It is solid at room temperature and can be easily handled during installation. The material turns from solid to liquid at around 50°C. In its liquid phase it can fill interface irregularities more efficiently than traditional thermal compounds as it adapts to the surface and takes its shape. It is the perfect replacement for all cooling systems that make use of thermal paste as a thermal compound. You can think of it as thermal paste in the shape of a pad. This means it is easier and less messy to apply than thermal paste, which makes it easier to use for beginners. Furthermore, it is more durable than thermal paste, as it does not dry out as quickly. Commong applications include CPUs, GPUs and any other cooling system that uses thermal paste as a thermal compound originally.

Types and Configurations

Thickness*	Available sizes*
0.1 mm	100×100 mm, 200×200 mm
0.3 mm	100×100 mm, 200×200 mm
0.3 mm	100×100 mm, 200×200 mm

* Custom configurations are available upon request, for worldwide industrial inquiries please contact us at: sales@extremecool360.com

Technical Properties

Properties	Unit	Value	Test method
Color	–	Gray	Visual
Thermal Conductivity	W/mK	6.0	ASTM D5470
Thermal Impedance	°C*in²/W	0.04	ASTM D5470
Density	g/cm³	2.0	ASTM D792
Temperature Range	°C	-40～+130	–
Volume Resistivity	ohm-cm	10⁷	ASTM D257

Gallery

Certificates & Datasheets